Yingstar Electronics Co., Ltd.

Home
About Us
PCB Services
Equipment
PCB Capabilities
Quality Assurance
Contact Us
Request A Quote
Home SamplesLow Volume PCB Assembly

RF HDI Low Volume PCB Assembly with blind and buried vias and 1.5oz outer copper 1oz inner copper

Customer Reviews
We've been using Yingstar for the past 8 months. We decided to move our PCB production from the US to Yingstar to get our costs down.

—— David Duncan--President – SET

I have no doubt about YingStar being our best production partner, last time we made 3000 units of our boards, only several pcs have some small issues.

—— Jaber Rahoutei--CEO

I'm Online Chat Now

Low Volume PCB Assembly

Low Volume PCB Assembly Sample Introduction

RF HDI Low Volume PCB Assembly with blind and buried vias and 1.5oz outer copper 1oz inner copper

China RF HDI Low Volume PCB Assembly with blind and buried vias and 1.5oz outer copper 1oz inner copper Supplier
RF HDI Low Volume PCB Assembly with blind and buried vias and 1.5oz outer copper 1oz inner copper Supplier RF HDI Low Volume PCB Assembly with blind and buried vias and 1.5oz outer copper 1oz inner copper Supplier

Large Image :  RF HDI Low Volume PCB Assembly with blind and buried vias and 1.5oz outer copper 1oz inner copper

Product Details:

Place of Origin: China
Brand Name: YINGSTAR
Certification: UL/ROHS/CE
Model Number: YSTP-ID V3-7

Payment & Shipping Terms:

Minimum Order Quantity: 5pcs
Price: negotiation
Packaging Details: Anti-static bag + Anti-static bubble wrap + Carton box
Delivery Time: 25 working days
Payment Terms: T/T, Western Union
Supply Ability: 20,000pcs per month
Contact Now
Detailed Product Description
Material: FR4(ER:5.1) Blind Vias: Yes
Buried Vias: Yes Via In Pad: Yes
Impedance Control: Yes Min Vias: 0.1mm
BGA Pitch: 0.2mm Layer: 6 Layers

 

 

RF&HDI PCB assembly with blind and buried vias and 1.5oz outer copper,

 

1oz inner copper

 

 

The specification of 6 layers Multilayer ENIG Circuit Board PCB for IR Remote Car Key is 32*32 mm, whcih is applied to IR Remote Car Key. The Copper thickness of the PCB is 1 Oz , with 0.1 mm minimum aperture.
 

 

 

Layer Stackup Structure of this board

 

RF HDI Low Volume PCB Assembly with blind and buried vias and 1.5oz outer copper 1oz inner copper

Via types of this board:

RF HDI Low Volume PCB Assembly with blind and buried vias and 1.5oz outer copper 1oz inner copper

Fine pitch BGA, 0.2mm pitch. 

RF HDI Low Volume PCB Assembly with blind and buried vias and 1.5oz outer copper 1oz inner copper

 

YINGSTAR produce this HDI PCB, purchase all the electronic components and assemble all the parts to the PCB board, and the test we do for this board are AOI inspection, X-Ray inspection( for BGAs) and functional test. 

 

X-Ray Machine:

RF HDI Low Volume PCB Assembly with blind and buried vias and 1.5oz outer copper 1oz inner copper

 

Functional Test Fixture for this board:

 

RF HDI Low Volume PCB Assembly with blind and buried vias and 1.5oz outer copper 1oz inner copper

RF HDI Low Volume PCB Assembly with blind and buried vias and 1.5oz outer copper 1oz inner copper

 

 

 

 

Contact Details
Shenzhen Yingstar Electronics Co., Ltd.

Contact Person: Michael Dong

Send your inquiry directly to us (0 / 3000)