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2 Layer Prototype PCBA Assembly 1OZ Green solder mask small boards makeup

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We've been using Yingstar for the past 8 months. We decided to move our PCB production from the US to Yingstar to get our costs down.

—— David Duncan--President – SET

I have no doubt about YingStar being our best production partner, last time we made 3000 units of our boards, only several pcs have some small issues.

—— Jaber Rahoutei--CEO

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Prototype PCB Assembly

Prototype PCB Assembly Sample Introduction

2 Layer Prototype PCBA Assembly 1OZ Green solder mask small boards makeup

China 2 Layer Prototype PCBA Assembly 1OZ Green solder mask small boards makeup Supplier
2 Layer Prototype PCBA Assembly 1OZ Green solder mask small boards makeup Supplier 2 Layer Prototype PCBA Assembly 1OZ Green solder mask small boards makeup Supplier

Large Image :  2 Layer Prototype PCBA Assembly 1OZ Green solder mask small boards makeup

Product Details:

Place of Origin: China
Brand Name: Yingstar
Certification: UL/ROHS/CE
Model Number: YCSl-Tss

Payment & Shipping Terms:

Minimum Order Quantity: 5pcs
Price: Negotiation
Packaging Details: Anti-static bag + Anti-static bubble wrap + Carton box
Delivery Time: 15 working days
Payment Terms: T/T, Western Union
Supply Ability: 100,000pcs per month
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Detailed Product Description
Material: FR4 Layer: 2
Surface Finish: Lead Free HASL Copper Thickness: 1OZ

 

2 Layer , 1OZ , Green solder mask , small boards makeup Prototype PCBA

Assembly

 

This PCB board is for keyboard of industrial machine.The solder mask of the PCB board is black and the copper thickness is 1 OZ with ENIG surface treatment and 1.6 mm board thickness.Its minimum aperture is 0.2 mm and the line width/spacing is 0.1/0.1 mm.

 

One stop service for PCB,components sourcing and PCB assembly

PCB Fabrication

► Components Sourcing

► PCB Assembly

► Function Testing if necessary

► Enclosure Assembly if necessary

we are highly qualified PCB assembly house. Our team is engaged in assembling SMT designs, and all of our employees are committed to providing total customer satisfaction during every step of the production process. Our staff is well educated and known as experts in this area.

We can provide both surface mount prototyping and low-volume production runs by means of both manual and automatic SMD assembly procedures. Single- and double-sided placement of all type of parts is executed by our trained assembly technicians.

 

We have the capabilities to assemble the following:

Ball Grid Array (BGA) Quad Flat Pack No-Lead (QFN)
Small Outline Integrated Circuit (SOIC) Plastic Leaded Chip Carrier (PLCC)
Quad Flat Package (QFP) Ultra-Fine Ball Grid Array (uBGA)
Package-On-Package (PoP) Small Chip Packages (pitch of 0.2 mm)

 

We are fully capable of assembling through-hole components. Our staff is able to work with chip packages as tiny as 0201 for passive components.

 

 

Contact Details
Shenzhen Yingstar Electronics Co., Ltd.

Contact Person: Michael Dong

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