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4 Layer Through Hole PCB Assembly FR4 green solder mask white silkscreen

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We've been using Yingstar for the past 8 months. We decided to move our PCB production from the US to Yingstar to get our costs down.

—— David Duncan--President – SET

I have no doubt about YingStar being our best production partner, last time we made 3000 units of our boards, only several pcs have some small issues.

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Through Hole PCB Assembly

Through Hole PCB Assembly Sample Introduction

4 Layer Through Hole PCB Assembly FR4 green solder mask white silkscreen

China 4 Layer Through Hole PCB Assembly FR4 green solder mask  white silkscreen Supplier

Large Image :  4 Layer Through Hole PCB Assembly FR4 green solder mask white silkscreen

Product Details:

Place of Origin: China
Brand Name: Yst
Certification: UL/ROHS/CE
Model Number: CM-yst

Payment & Shipping Terms:

Minimum Order Quantity: 5PCS
Price: Negotiation
Packaging Details: Anti-static bag + Anti-static bubble wrap + Carton box
Delivery Time: 21 working days
Payment Terms: T/T, Western Union
Supply Ability: 100,000pcs per month
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Detailed Product Description
Material: FR4 Solder Mask: Green
Layer: 4 Copper Weight: 1OZ

 

 

4 layer , FR4 , green solder mask , white silkscreen , Through Hole PCB Assembly

 

 

The fabrication of this 4-layer and FR4 PCB is 1OZ Copper thickness, 1.6mm board thickness, Hot Air Solder Level, green soldermask and white silkscreen, also with impedance control.

 

 

 

 

 

 
Yingstar provide both surface mount prototyping and low-volume production runs by means of both manual and automatic SMD assembly procedures. Single- and double-sided placement of all type of parts is executed by our trained assembly technicians.

 

Here is the information about our technical capabilities of PCB and PCBA assembly

 

1.Detailed Specification of PCB Manufacturing

 

 

Layer 1-36 layer
Max Board Size 1100*599mm 43.3" * 24"
Min Board Thickness 4 layer 0.40mm 16mil
6 layer 1.00mm 40mil
8 layer 1.20mm 48mil
10 layer 1.60mm 60mil
Min space 0.075mm 3mil
Min line width 0.075mm 3mil
Min hole size 0.1mm 4mil
Plated wall thickness 0.025mm 1mil
Plated hole dia tolerance ±0.10mm 4mil
NO Plated hole dia tolerance ±0.05mm 2mil
Outline tolerance ±0.15mm 6mil
Twist and bent ≤1.5%
Board thickness tolerance ±10%
Copper weight 0.5oz, 1.0 oz, 1.5oz, 2.0oz,3.0 oz,4.0 oz
Surface finish HASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc.
Board material FR-4 glass epoxy, FR4 High Tg, RoHS
compliant; Aluminum, Rogers, etc.
Insulation resistance 1012Ω (Normal)
Through hole resistance <300Ω(Normal)
Electric strength >1.3KV/mm
Current strength 10A
Peel strength 1.5N/mm
Thermal stress 288℃20 Seconds
Flammability 94V-0
Test voltage 50-300V

 

2.Our state-of-the-art SMT manufacturing assembly lines have below features

 

 

 

 

1

Automated solder stencil printers with paste inspection;
2 High speed SMT machines, SMT placement capability to 01005 component size;
3 SMT pick-and-place equipment with 3″ square bottom vision capability;
4 Both convection and conduction twelve temperature zone reflow oven;
5 Precision dispensing equipment with positive displacement pumps;
6 Automated wave soldering machine for throug hole parts;
7 Automated Optical Inspection; Automated X-Ray Inspection, BGA reballing rework station.

 

3.Quote requirement for pcb&pcb assembly:

 

4 Layer Through Hole PCB Assembly FR4 green solder mask  white silkscreen Gerber file and Bom list

4 Layer Through Hole PCB Assembly FR4 green solder mask  white silkscreen Clear pics of pcba or pcba sample for us if possible

4 Layer Through Hole PCB Assembly FR4 green solder mask  white silkscreen Test method or test fixture for PCBA if possible

 

 

Contact Details
Shenzhen Yingstar Electronics Co., Ltd.

Contact Person: Michael Dong

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