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6 Layer Low Volume Circuit Board Assembly With Green Solder OSP OEM / ODM Available

Customer Reviews
We've been using Yingstar for the past 8 months. We decided to move our PCB production from the US to Yingstar to get our costs down.

—— David Duncan--President – SET

I have no doubt about YingStar being our best production partner, last time we made 3000 units of our boards, only several pcs have some small issues.

—— Jaber Rahoutei--CEO

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Low Volume PCB Assembly

Low Volume PCB Assembly Sample Introduction

6 Layer Low Volume Circuit Board Assembly With Green Solder OSP OEM / ODM Available

China 6 Layer Low Volume Circuit Board Assembly With Green Solder OSP OEM / ODM Available Supplier

Large Image :  6 Layer Low Volume Circuit Board Assembly With Green Solder OSP OEM / ODM Available

Product Details:

Place of Origin: China
Brand Name: YINGSTAR
Certification: UL/ROHS/CE
Model Number: Yst-bb

Payment & Shipping Terms:

Minimum Order Quantity: 5 PCS
Price: Negotiation
Packaging Details: Anti-static bag + Anti-static bubble wrap + Carton box
Delivery Time: 15-20 working days
Payment Terms: T/T, Western Union
Supply Ability: 100,000pcs per month
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Detailed Product Description
Material: FR4 Solder Mask: Blue
Copper Weight: 1OZ Surface Finish: HASL
Board Size:: 210 * 168 MM Min. Aperture:: 0.25 MM


6 Layer FR4 Printed Circuit Board With Green Solder OSP OEM / ODM



For FR4 PCB Board manufacturing, LEFANG has been certificated as ISO19001 : 2008. The layer count of this FR4 PCB Circuit Board is 6 layers with only 1.2 mm board thickness. And the minimum Line width and space of the PCB is 0.09 mm.


1. Technical requirement for pcb&pcb assembly:

  • Professional Surface-mounting and Through-hole soldering Technology
  • Various sizes like 1206,0805,0603,0402,0201 components SMT technology
  • ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
  • PCB Assembly With UL,CE,Rohs Approval
  • Nitrogen gas reflow soldering technology for SMT.
  • High Standard SMT&Solder Assembly Line
  • High density interconnected board placement technology capacity.


2. Our PCB Technical Specification:


Layer 1-36 layer
Max Board Size 1100*599mm 43.3" * 24"
Min Board Thickness 4 layer 0.40mm 16mil
6 layer 1.00mm 40mil
8 layer 1.20mm 48mil
10 layer 1.60mm 60mil
Min space 0.075mm 3mil
Min line width 0.075mm 3mil
Min hole size 0.1mm 4mil
Plated wall thickness 0.025mm 1mil
Plated hole dia tolerance ±0.10mm 4mil
NO Plated hole dia tolerance ±0.05mm 2mil
Outline tolerance ±0.15mm 6mil
Twist and bent ≤1.5%
Board thickness tolerance ±10%
Copper weight 0.5oz, 1.0 oz, 1.5oz, 2.0oz,3.0 oz,4.0 oz
Surface finish HASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc.
Board material FR-4 glass epoxy, FR4 High Tg, RoHS
compliant; Aluminum, Rogers, etc.
Insulation resistance 1012Ω (Normal)
Through hole resistance <300Ω(Normal)
Electric strength >1.3KV/mm
Current strength 10A
Peel strength 1.5N/mm
Thermal stress 288℃20 Seconds
Flammability 94V-0
Test voltage 50-300V


3. Our PCBA Capabilities:


  • Type of Assembly:SMT,Thru-hole
  • Solder Type:Water Soluble Solder Paste,Leaded and Lead-Free
  • Components:1.Passive Down to 0201 size 2. BGA and VFBGA 3.Double-sided SMT Assembly 4.BGA Repair and Reball 5.Part Removal and Replacement
  • File Formate:1.Bill of Materials 2.Gerber files 3Pick-N-Place file
  • Testing:Flying Probe Test,X-ray Inspection AOI Test
  • PCB assembly process:Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing


Contact Details
Shenzhen Yingstar Electronics Co., Ltd.

Contact Person: Michael Dong

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