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4 Layer Low Volume PCB Assembly Black solder mask with several BGA chip and micro SD card

Customer Reviews
We've been using Yingstar for the past 8 months. We decided to move our PCB production from the US to Yingstar to get our costs down.

—— David Duncan--President – SET

I have no doubt about YingStar being our best production partner, last time we made 3000 units of our boards, only several pcs have some small issues.

—— Jaber Rahoutei--CEO

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Low Volume PCB Assembly

Low Volume PCB Assembly Sample Introduction

4 Layer Low Volume PCB Assembly Black solder mask with several BGA chip and micro SD card

China 4 Layer Low Volume PCB Assembly Black solder mask with several BGA chip and micro SD card Supplier
4 Layer Low Volume PCB Assembly Black solder mask with several BGA chip and micro SD card Supplier 4 Layer Low Volume PCB Assembly Black solder mask with several BGA chip and micro SD card Supplier

Large Image :  4 Layer Low Volume PCB Assembly Black solder mask with several BGA chip and micro SD card

Product Details:

Place of Origin: China
Brand Name: YINGSTAR
Certification: UL/ROHS/CE
Model Number: Yst-pro1

Payment & Shipping Terms:

Minimum Order Quantity: 5PCS
Price: Negotiation
Packaging Details: Anti-static bag + Anti-static bubble wrap + Carton box
Delivery Time: 10-15working days
Payment Terms: T/T, Western Union
Supply Ability: 100,000pcs per month
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Detailed Product Description
Material: FR4 Solder Mask: Black
Layer: 4 Impedance Control: Yes
Functional Test: Yes Surface Finish: ENIG

 

4Layer Black solder mask with several BGA chip and micro SD card with

simple test view

 

 

The 4 layers black Solder PCB Board PCB is applied for Medical X-ray Machine, which board thickness is 1.6 mm. And its the minimum aperture is 0.2 mm and the line width and space are both 0.1 mm. While the surface treatment of the copper base PCB is ENIG with black solder.

 

 

Low Volume PCB Assembly:

 

1, Double sided SMD&THT with fine pitch QFN chips and BGA chips

2, Minimum package 0201

3, Apply 100% AOI, X-RAY, Functional test

4, Minimum PCB line space&width 3mil with impedance control and ENIG surface finish

5, No fake parts or recycled parts

6, Alternative parts are appoved by customers before production

7, At least 1 years warranty

8, Providing one-stop services from PCB fabrication, electronic parts sourcing and PCB assembly

 

Detailed Specification of PCB Manufacturing

 

Layer 1-36 layer
Max Board Size 1100*599mm 43.3" * 24"
Min Board Thickness 4 layer 0.40mm 16mil
6 layer 1.00mm 40mil
8 layer 1.20mm 48mil
10 layer 1.60mm 60mil
Min space 0.075mm 3mil
Min line width 0.075mm 3mil
Min hole size 0.1mm 4mil
Plated wall thickness 0.025mm 1mil
Plated hole dia tolerance ±0.10mm 4mil
NO Plated hole dia tolerance ±0.05mm 2mil
Outline tolerance ±0.15mm 6mil
Twist and bent ≤1.5%
Board thickness tolerance ±10%
Copper weight 0.5oz, 1.0 oz, 1.5oz, 2.0oz,3.0 oz,4.0 oz
Surface finish HASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc.
Board material FR-4 glass epoxy, FR4 High Tg, RoHS
compliant; Aluminum, Rogers, etc.
Insulation resistance 1012Ω (Normal)
Through hole resistance <300Ω(Normal)
Electric strength >1.3KV/mm
Current strength 10A
Peel strength 1.5N/mm
Thermal stress 288℃20 Seconds
Flammability 94V-0
Test voltage 50-300V

 

Quote requirement:

 

  • Gerber file of the bare PCB board
  •  BOM (Bill of material) for assembly
  • To short the lead time, please kindly advise us if there is any acceptable components substitution.
  • Testing Guide & Test Fixtures if necessary
  • Programming files & Programming tool if necessary
  • Schematic if necessary

More detailed test view:

4 Layer Low Volume PCB Assembly Black solder mask with several BGA chip and micro SD card

 

4 Layer Low Volume PCB Assembly Black solder mask with several BGA chip and micro SD card

 

 

Contact Details
Shenzhen Yingstar Electronics Co., Ltd.

Contact Person: Michael Dong

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