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Rogers Industrial Control PCB Assembly with battery and module green immersion , SMD PCB Assembly

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Industrial Control PCB Assembly

Industrial Control PCB Assembly Sample Introduction

Rogers Industrial Control PCB Assembly with battery and module green immersion , SMD PCB Assembly

China Rogers Industrial Control PCB Assembly with battery and module green immersion , SMD PCB Assembly Supplier

Large Image :  Rogers Industrial Control PCB Assembly with battery and module green immersion , SMD PCB Assembly

Product Details:

Place of Origin: China
Brand Name: YINGSTAR
Certification: UL/CE/ROHS
Model Number: YSPA09

Payment & Shipping Terms:

Minimum Order Quantity: 5pcs
Price: Negotiation
Packaging Details: Anti-static bag + Anti-static bubble wrap + Carton box
Delivery Time: 15 working days
Payment Terms: T/T, Western Union
Supply Ability: 100,000pcs per month
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Detailed Product Description
Layer: 6 Material: Rogers
Impedance Control: Yes Color: Black And Blue
Thickness: 1.8mm Copper Weight: 1 OZ


 

 

 

6 layers with battery and module black immersion SMD PCB Assembly 

 

 

 

The specification of the 6 layers double sided high frequency PCB circuit board is 33 * 31 mm, witch is applied to mobile communication device. The Copper thickness of the high frequency PCB is 1 Oz / 35 µm, with 0.2 mm minimum aperture.

 

 

 

1. Detailed Specification of PCB Manufacturing

 

 

Layer 1-36 layer
Max Board Size 1100*599mm 43.3" * 24"
Min Board Thickness 4 layer 0.40mm 16mil
6 layer 1.00mm 40mil
8 layer 1.20mm 48mil
10 layer 1.60mm 60mil
Min space 0.075mm 3mil
Min line width 0.075mm 3mil
Min hole size 0.1mm 4mil
Plated wall thickness 0.025mm 1mil
Plated hole dia tolerance ±0.10mm 4mil
NO Plated hole dia tolerance ±0.05mm 2mil
Outline tolerance ±0.15mm 6mil
Twist and bent ≤1.5%
Board thickness tolerance ±10%
Copper weight 0.5oz, 1.0 oz, 1.5oz, 2.0oz,3.0 oz,4.0 oz
Surface finish HASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc.
Board material FR-4 glass epoxy, FR4 High Tg, RoHS
compliant; Aluminum, Rogers, etc.
Insulation resistance 1012Ω (Normal)
Through hole resistance <300Ω(Normal)
Electric strength >1.3KV/mm
Current strength 10A
Peel strength 1.5N/mm
Thermal stress 288℃20 Seconds
Flammability 94V-0
Test voltage 50-300V

 

2. Detailed Terms for Pcb Assembly

 

Technical Requirement

 

  • Professional Surface-mounting and Through-hole soldering Technology
  • Various sizes like 1206,0805,0603 components SMT technology
  • ICT(In Circuit Test),FCT(Functional Circuit Test) technology
  • PCB Assembly With UL,CE,FCC,Rohs Approval
  • Nitrogen gas reflow soldering technology for SMT
  • High Standard SMT&Solder Assembly Line
  • High density interconnected board placement technology capacity

Quote&Production Requirement

  • Gerber File or PCB File for Bare PCB Board Fabrication
  • Bom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assembly
  • To reduce the quote time, please provide us the full part number for each components,Quantity per board also the quantity for orders.
  • Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate

 

State-of-the-art SMT manufacturing assembly lines

 

3. Production Details:

 

1) Material Management

Supplier → Components Purchase → IQC → Protection Control → Material Supply → Firmware

 

2) Program Management

PCB Files → DCC → Program Organizing → Optimization → Checking

 

3) SMT Management

PCB Loader → Screen Printer → Checking → SMD Placement → Checking → Air Reflow → Vision Inspection → AOI → Keeping

 

4) PCBA Management

THT→Soldering Wave (Manual Welding) → Vision Inspection → ICT → Flash → FCT → Checking → Package → Shipment

 

Contact Details
Shenzhen Yingstar Electronics Co., Ltd.

Contact Person: Michael Dong

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