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ENIG HASL OSP Industrial Control PCB Assembly , Multilayer PCB Board

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Industrial Control PCB Assembly

Industrial Control PCB Assembly Sample Introduction

ENIG HASL OSP Industrial Control PCB Assembly , Multilayer PCB Board

China ENIG HASL OSP Industrial Control PCB Assembly , Multilayer PCB Board Supplier

Large Image :  ENIG HASL OSP Industrial Control PCB Assembly , Multilayer PCB Board

Product Details:

Place of Origin: China
Brand Name: YINGSTAR
Certification: UL/ROHS/CE
Model Number: Yst-Ds

Payment & Shipping Terms:

Minimum Order Quantity: 5PCS
Price: Negotiation
Packaging Details: Anti-static bag + Anti-static bubble wrap + Carton box
Delivery Time: 15-20working days
Payment Terms: T/T, Western Union
Supply Ability: 100,000pcs per month
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Detailed Product Description
Material: FR4 Solder Mask: Green
Layer: 4 Min Line Widths: 0.1MM/4Mil
Min Space: 0.1MM/4MIl Copper Weight: 1OZ

 

 

 

Multilayer PCB Board with ENIG HASL OSP Industrial Control PCB Assembly

 

 

The layer of Double Sided PCB Board PCB Prototype for Keyboard Keypad is 2 with ENIG surface treatment.The copper thickness is 1 OZ and the board thickness is 1.6 mm.The solder mask of the PCB board is blue and the minimum aperture is 0.2 mm.

 

 

1. Detailed Specification of PCB Manufacturing

 

 

Layer 1-36 layer
Max Board Size 1100*599mm 43.3" * 24"
Min Board Thickness 4 layer 0.40mm 16mil
6 layer 1.00mm 40mil
8 layer 1.20mm 48mil
10 layer 1.60mm 60mil
Min space 0.075mm 3mil
Min line width 0.075mm 3mil
Min hole size 0.1mm 4mil
Plated wall thickness 0.025mm 1mil
Plated hole dia tolerance ±0.10mm 4mil
NO Plated hole dia tolerance ±0.05mm 2mil
Outline tolerance ±0.15mm 6mil
Twist and bent ≤1.5%
Board thickness tolerance ±10%
Copper weight 0.5oz, 1.0 oz, 1.5oz, 2.0oz,3.0 oz,4.0 oz
Surface finish HASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc.
Board material FR-4 glass epoxy, FR4 High Tg, RoHS
compliant; Aluminum, Rogers, etc.
Insulation resistance 1012Ω (Normal)
Through hole resistance <300Ω(Normal)
Electric strength >1.3KV/mm
Current strength 10A
Peel strength 1.5N/mm
Thermal stress 288℃20 Seconds
Flammability 94V-0
Test voltage 50-300V

 

 

2. Detailed Terms for Pcb Assembly

 

Technical requirement:

 

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603,0402,0201 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology

4) PCB Assembly With UL,CE,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

 

 

3.Quote requirement:

 

♦ Gerber file of the bare PCB board

♦ BOM (Bill of material) for assembly

♦ To short the lead time, please kindly advise us if there is any acceptable components substitution.

♦ Testing Guide & Test Fixtures if necessary

♦ Programming files & Programming tool if necessary

♦ Schematic if necessary

 

Contact Details
Shenzhen Yingstar Electronics Co., Ltd.

Contact Person: Michael Dong

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