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Small SMD PCB Assembly , FR4 Multilayer Printed Circuit Board With UL ROHS REACH 0.5-6oz

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We've been using Yingstar for the past 8 months. We decided to move our PCB production from the US to Yingstar to get our costs down.

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I have no doubt about YingStar being our best production partner, last time we made 3000 units of our boards, only several pcs have some small issues.

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SMD PCB Assembly

SMD PCB Assembly Sample Introduction

Small SMD PCB Assembly , FR4 Multilayer Printed Circuit Board With UL ROHS REACH 0.5-6oz

China Small SMD PCB Assembly , FR4 Multilayer Printed Circuit Board  With UL ROHS REACH 0.5-6oz Supplier
Small SMD PCB Assembly , FR4 Multilayer Printed Circuit Board  With UL ROHS REACH 0.5-6oz Supplier Small SMD PCB Assembly , FR4 Multilayer Printed Circuit Board  With UL ROHS REACH 0.5-6oz Supplier

Large Image :  Small SMD PCB Assembly , FR4 Multilayer Printed Circuit Board With UL ROHS REACH 0.5-6oz

Product Details:

Place of Origin: China
Brand Name: YINGSTAR
Certification: UL/CE/ROHS
Model Number: YSPA074

Payment & Shipping Terms:

Minimum Order Quantity: 5pcs
Price: Negotiation
Packaging Details: Anti-static bag + Anti-static bubble wrap + Carton box
Delivery Time: 15-20working days
Payment Terms: T/T, Western Union
Supply Ability: 100,000pcs per month
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Detailed Product Description
Layer: 6 Color: Green
Material: FR4 Surface Finish: Immersion Gold
Thickness: 1.6mm Copper Weight: 2 OZ

 

FR4 Multilayer PCB Board With UL ROHS REACH 0.5-6oz small pcb

 

For FR4 SMD PCB Assembly, LEFANG has been certificated as ISO19001:2008. The thickness of this board is 1.6mm with 6 layers. Also, the surface finish is immersion gold.

 

 

1.Technical requirements for pcb&pcb assembly:

 

  • Professional Surface-mounting and Through-hole soldering Technology
  • Various sizes like 1206,0805,0603,0402,0201 components SMT technology
  • ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
  • PCB Assembly With UL,CE,Rohs Approval
  • Nitrogen gas reflow soldering technology for SMT.
  • High Standard SMT&Solder Assembly Line
  • High density interconnected board placement technology capacity.
  •  

2.Our PCBA Capabilities

 

Type of Assembly SMT,Thru-hole
Solder Type Water Soluble Solder Paste,Leaded and Lead-Free
Components Passive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Bare Board Size Smallest:0.25*0.25 inches
Largest:20*20 inches
File Formate Bill of Materials
Gerber files
Pick-N-Place file
Types of Service Turn-key,partial turn-key or consignment
Component packaging Cut Tape,Tube,Reels,Loose Parts
Testing Flying Probe Test,X-ray Inspection AOI Test
PCB assembly process Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

 

3. Our PCB Technical Specification

 

Layer 1-36 layer
Max Board Size 1100*599mm 43.3" * 24"
Min Board Thickness 4 layer 0.40mm 16mil
6 layer 1.00mm 40mil
8 layer 1.20mm 48mil
10 layer 1.60mm 60mil
Min space 0.075mm 3mil
Min line width 0.075mm 3mil
Min hole size 0.1mm 4mil
Plated wall thickness 0.025mm 1mil
Plated hole dia tolerance ±0.10mm 4mil
NO Plated hole dia tolerance ±0.05mm 2mil
Outline tolerance ±0.15mm 6mil
Twist and bent ≤1.5%
Board thickness tolerance ±10%
Copper weight 0.5oz, 1.0 oz, 1.5oz, 2.0oz,3.0 oz,4.0 oz
Surface finish HASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc.
Board material FR-4 glass epoxy, FR4 High Tg, RoHS
compliant; Aluminum, Rogers, etc.
Insulation resistance 1012Ω (Normal)
Through hole resistance <300Ω(Normal)
Electric strength >1.3KV/mm
Current strength 10A
Peel strength 1.5N/mm
Thermal stress 288℃20 Seconds
Flammability 94V-0
Test voltage 24-300V

 

 

 

 

 

 

Contact Details
Shenzhen Yingstar Electronics Co., Ltd.

Contact Person: Michael Dong

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